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Equipment of the Nanostructure Service Laboratory

Most nanofabrication facilities are housed in a cleanroom class 6 and 7 environment. Access
to the cleanroom is under keycard control and new users require a course of instruction which is offered regularly, at least once a month. In order to make an appointment please contact: Gernot Goll

The usage of all equipment is subject to usage fees. Please find the latest NSL fee schedule here. The document and it's content are for internal use only. External users should contact the NSL Manager and ask for a quotation.

Following equipment is installed in the cleanroom:

Further equipment at ambient conditions:

Training on the instruments provided by the staff members in charge of the equipment is mandatory for new users. For almost any piece of equipment trained users should make a reservation via the online
booking system
.

 

 

Electron Beam Lithography

 

Key points in e-beam writing:

    + energy 50keV or (25keV)

    + overlay better than 40nm (3x sigma)

    + stitching error better than 40nm (3x sigma)

    + minimum feature size 10nm

    + writefield 100µm / 1mm or (200µm / 2mm)

    + substrate sizes: 2" or 4" wafer, 15x15mm or 20x20mm pieces

    + data processing and proximity correction

 

Staff member in charge of this equipment: Silvia Diewald, Patrice Brenner

 

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Focused Ion Beam Lithography

 

Key points: 

     + focused beam of Ga-ions

 

     + FIB and SEM imaging  

 

     + energy: 2-30keV

 

     + point-resolution: 7nm@30keV 

     + aspect ratio: 1:3 

     + structuring by milling and sputtering 

     + cross-sections at well defined position 

     + targeted TEM-sample preparation 

     + structuring by defined deposition of Pt, W, SiO2

 

     + controlled by scanning electron microscopy (SEM)

 

     + composition quantification by X-ray spectroscopy

 

 

Staff member in charge of this equipment: Patrice Brenner, Silvia Diewald

 

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Optical Lithography

 

  • near UV (λ=365nm and 405nm) mask alignment

     + proximity and vacuum contact

     + substrates up to 6"

     + minimum feature size 0,7μm

     + alignment accuracy 0.5 μm

 

  • direct laser lithography

     + Diode-Laser λ=405nm

     + interferometer stage

     + substrates up to 9"

     + minimum feature size 0,7μm

     + alignment accuracy 0,5μm

 

Staff member in charge of this equipment: Aina Quintilla, Lucas Radtke

 

 

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Dry Etching

 

  • Reactive ion etching in fluorine based plasmas

     + Gases: SF6, CF4, CHF3, C4F8, O2, N2, Ar
     + Substrates up to 4"
 

  • Inductively coupled chlorine based plasmas (ICP)

     + Gases: SiCl4, Cl2, HBr, H2, CH4, O2, Ar
     + Substrates up to 4"
     + variable substrate temperature 273 - 343K
 

  • Low pressure plasma cleaner

     + Gases: O2
     + Substrates up to 8"
     + Borosilicate glass vacuum chamber

Staff member in charge of this equipment: Gernot Goll, Aina Quintilla

 

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 Deposition

 

  • Sputtering: Cr, Au, Pt

 

  • e-gun evaporation

 

  • thermal evaporation
  • shadow evaporation

Staff member in charge of this equipment: Patrice Brenner , Hannes Rotzinger

 

 

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Wet Processing

 

  • resist processing (spinners, hot plates, oven)
  • ultrasone, megasone
  • cleaning and wet etching
  • HF wet bench

 

Staff member in charge of this equipment: Florian Rupp, Aina Quintilla

 

 

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Total Internal Reflection Fluorescence (TIRF) Microscopy

 

Key points:

     + dual laser illumination  (λ=491nm and 561nm)

 

     + sensitive fluorescence camera

 

     + Förster resonance energy transfer (FRET) setup

 

     + temperature control for live-cell imaging

 

     + time-lapse imaging

Scientist in charge of this equipment: N.N.

 

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Scanning Electron Microscope

 

Key points:

     + thermal field emission cathode (Schottky type)

     + low vacuum mode

     + 4-tip pico-probe module

     + external scan drive for lithography

Staff member in charge of this equipment: Silvia Diewald, Patrice Brenner

 

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Table Top SEM

 

Key points:

     + maximum magnification 24.000x

     + 5kV fix

     + backscattered electron detector

Staff member in charge of this equipment: Silvia Diewald, Patrice Brenner

 

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